Ntxuav Micro-Qhov hauv iav: Ntsuab Laser Punching nrog LGWL-5WSL
iav. Txhaum. Nyuaj. Mechanical Drilling? Chips nyob txhua qhov chaw. CO₂ lasers? Thermal stress, uncontrolled cracking. Tsis zoo. LGWL-5WSL yog lub laser ntsuab (532 nm) txee xuas nrig ntaus tshuab. Tsim los rau high-precision micro-qhov drilling hauv iav . 5 watts. Nanosecond pulsed ntsuab laser. Tshem tawm cov khoom los ntawm kev tswj cov duab-thermal ablation. Hloov, huv qhov. Tsawg kawg taper. Tsis muaj ntug chipping. Daim ntawv thov? Microfluidic chips, cov khoom siv kho mob, ntim khoom siv hluav taws xob, tso saib iav npog. LGWL-5WSL yog lub cuab yeej.
Vim li cas Green Laser rau iav Punching?
532nm ua. Nruab nrab absorbed los ntawm ntau tsom iav - dej qab zib-lime, borosilicate, quartz. Qhov zoo tshaj plaws tshuav. Kev nqus txaus kom tshem tawm cov khoom zoo. Txawm li cas los xij, tsawg txaus kom tsis txhob muaj cua sov saum npoo tsuas yog ua rau thermal shock. Luv mem tes dav? Tsawg dua 15 nanoseconds. Tsim lub zog siab kawg nkaus. Vaporizes lub khob ua ntej tshav kub tuaj yeem mus rau thaj tsam ib puag ncig. Qhov tshwm sim? Ntxuav lub qhov. Thaum tshav kub kub-cuam tshuam cheeb tsam feem ntau tsawg dua 5 microns.
Zaus-ob npaug Nd: YVO₄ laser qhov chaw. Lub zog nruab nrab: 5 W. Beam zoo M² <1.3. Tsom pom qhov loj me: 20-30 microns. Pulse repetition zaus adjustable ntawm 20 kHz txog 200 kHz. Tus neeg teb xov tooj tuaj yeem ua kom zoo ntawm qhov nrawm thiab ntug zoo. Rau punching qhov? Ob txoj kev: trepanning (scans ib ncig txoj kev) los yog percussion drilling (ntau pulses ntawm ib qho chaw). LGWL-5WSL muab kev xaiv rau koj.
Lub qhov taub, qhov tob, thiab qhov sib piv
Qhov diameters? Los ntawm 0.05 hli (50 micrometers) mus txog 5 hli. Me dua 0.5 hli? Txoj kev percussion ib leeg yog ceev tshaj plaws. Loj dua txoj kab uas hla? Trepanning - scanning txoj kev ncig. Qhov siab tshaj plaws iav thickness rau huv drilling? Nyob ntawm hom iav.
Soda-lime iav: mus txog 3 hli. Borosilicate iav (Pyrex): mus txog 4 hli. Quartz iav (fused silica): mus txog 2 hli.
Nrog rau kev xaiv lub lens ntev (focal ntev 254 mm), ua haujlwm nrug nce. Txhim kho qhov tob tob. Qhov zoo ntawm qhov ntsuas: txoj kab uas hla qhov tseeb ± 15 micrometers, lub qhov sib npaug ntau dua 95%, lub kaum sab xis qis dua 2 degrees (kev nkag loj dua li tawm), ntug chipping hauv qab 10 micrometers. Crack-free tawm los tshaj 99% thaum siv optimized tsis. LGWL-5WSLis precise.
Txheej txheem Parameters rau iav Punching
Built-in "iav drilling" software module. Pre-set parameters rau txhua hom iav. Tus neeg siv nkag mus rau qhov xav tau lub qhov taub thiab iav thickness. Software xam pom txoj kev scan zoo, tus lej hla, lub zog, zaus. Piv txwv li: xyaum 0.5 hli txoj kab uas hla lub qhov los ntawm 1 hli tuab soda-lime iav. Kev teeb tsa: lub zog ntawm 80-100% ntawm 5 W siab tshaj plaws, mem tes zaus ntawm 50-80 kHz, trepanning ceev ntawm 200-400 mm / s, 1-3 hla, pab huab cua ntawm 0.5-1 bar kom tshem cov khib nyiab.
Qhov muag qhov muag? Tsis yog los ntawm tag nrho cov thickness. Rau cov cim kev sib raug zoo lossis cov yam ntxwv anchoring. Qhov muag tsis pom qhov tob tswj nyob rau hauv ± 25 micrometers los ntawm kev kho tus lej ntawm kev hla. LGWL-5WSL ua dhau los thiab dig muag.
Kev sib piv nrog lwm cov iav Drilling txoj kev
Mechanical drilling nrog pob zeb diamond khoom? 2-5 vib nas this rau ib lub qhov. Tab sis tsis zoo ntug zoo. Chiping. CO₂ lasers? Ceev - 0.5-1 vib nas this. Tab sis melting. Siab thermal-cracking txaus ntshai. Waterjet txiav? qeeb - 10-30 vib nas this. Tawm jagged ntug. Lub tshuab no? Ua kom tiav ib lub qhov hauv 0.3-2 vib nas this (nyob ntawm txoj kab uas hla thiab thickness). Zoo heev ntug zoo. Zoo tsis muaj cracking. Cua txias laser qhov chaw - tsis muaj chiller. Kev tsim kho lub xeev - tsis muaj khoom siv. Cov nqi khiav lag luam qis dua. LGWL-5WSL yeej.
Daim ntawv thov thiab cov neeg siv Case
Cov khoom siv microfluidic. Ib lub chaw tshawb fawb siv lub tshuab no los laum 0.2 hli inlet / qhov chaw nres nkoj hauv 1 hli borosilicate chips. Qhov yuav tsum tsis txhob ua tom qab ua tiav. Foob ncaj qha nrog O-rings. Cov txheej txheem 50 chips ib teev.
Kho mob iav vials. Lub tuam txhab kev lag luam ntim tshuaj punches 1 hli vent qhov hauv iav vials rau khov-drying. Ntsuab laser tsim cov qhov du. Tsis muaj iav hais los. Ua tau raws li FDA cov cai. Peev Xwm: 2,000 vials ib teev.
Zaub npog iav. Lub chaw tsim khoom siv kov-vaj huam sib luag xyaum 0.4 hli qhov rau ambient lub teeb sensors hauv 0.7 hli dej qab zib-lime iav. Cov npoo huv si dhau qhov kev xeem 50-gram pob poob.
Saib crystals. Lub watchmaker xuas nrig ntaus 0.8 hli qhov hauv cov iav pob zeb siv lub XY theem. Tsis siv neeg ua tiav. LGWL-5WSL tuav lawv txhua tus.
Cov ntsiab lus
Lub LGWL-5WSL ntsuab laser iav xuas nrig ntaus tshuab yog lub siab-precision cuab tam rau tsim micro-qhov nyob rau hauv ntau yam iav . 5 watts . 532 nm. Nanosecond-pulsed. Ua puag ncig, huv si, tsis muaj qhov tawg. Txoj kab uas hla me me li 50 micrometers. Txee tsim kom muaj kev nyab xeeb ntawm Class I laser. Optional XY theem thiab CCD lub zeem muag pab kom automated batch ua. Rau cov khoom siv kho mob, microfluidics, electronics, zaub industries - lub tshuab no hloov cov nqi sib cog lus thiab tsis sib xws mechanical drilling. Txhim khu kev daws teeb meem hauv tsev. LGWL-5WSL tau ua tiav.
Cim npe nrov: ntsuab lub teeb iav laser xuas nrig ntaus tshuab, Tuam Tshoj ntsuab lub teeb iav laser xuas nrig ntaus tshuab manufacturers, lwm tus neeg, Hoobkas
